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preliminary publication release date: september 27, 2006 revision 1.3-s isd1700 series multi-message single-chip voice record & playback devices
isd1700 series - 2 - table of contents 1 general des cription ............................................................................................................ ..3 2 features....................................................................................................................... ...............4 3 block di agram.................................................................................................................. .........5 4 pinout conf igurati on........................................................................................................... .6 5 pin descri ption ................................................................................................................ .........7 6 modes of o peratio ns ............................................................................................................ .8 6.1 standalone (push-bu tton) mode .............................................................................................8 6.2 spi mode ....................................................................................................................... ..........8 7 timing di agrams ................................................................................................................ ........8 7.1 standalone oper ation ........................................................................................................... ...8 7.2 spi oper ation.................................................................................................................. .......12 8 absolute maximu m ratings ................................................................................................13 8.1 operating conditi ons ........................................................................................................... ..13 9 electrical chara cteristi cs .............................................................................................14 9.1 dc parame ters .................................................................................................................. ....14 9.2 ac para meters.................................................................................................................. .....15 10 typical applicat ion circui ts.............................................................................................16 10.1 good audio design practice s ................................................................................................18 11 packaging ...................................................................................................................... ...........19 11.1 28-lead 8x13.4mm plastic thin small out line package (tsop) type 1 - iqc....................19 11.2 28-lead 300-mil plastic small outli ne integrated circ uit (soi c) ..........................................20 11.3 28-lead 600-mil plastic dual inline package (pdip) ............................................................21 11.4 die inform ation................................................................................................................ .......21 12 ordering info rmatio n .........................................................................................................22 13 version hi story................................................................................................................ ......23
isd1700 series publication release date: september 27, 2006 - 3 - revision 1.3-s 1 general description the winbond ? isd1700 chipcorder ? series is a high quality, fully integrated, single-chip multi- message voice record and playback device ideally su ited to a variety of electronic systems. the message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the specific device. the sampling frequency of each dev ice can also be adjusted from 4 khz to 12 khz with an external resistor, giving the user greater fl exibility in duration versus recording quality for each application. operating voltage spans a range from 2. 4 v to 5.5 v to ensure that the isd1700 devices are optimized for a wide range of ba ttery or line-powered applications. the isd1700 is designed for operation in either st andalone or microcontroller (spi) mode. the device incorporates a proprietary message management syst em that allows the chip to self-manage address locations for multiple messages. this unique featur e provides sophisticated messaging flexibility in a simple push-button environment. the devices include an on-chip oscillator (with external resistor control), microphone preamplifier with automatic ga in control (agc), an auxiliary analog input, anti- aliasing filter, multi-level storage (mls) array, smoothing filter, volume control, pulse width modulation (pwm) class d speaker driver, and current/voltage output. the isd1700 devices also support an optional ?valert? (voicealert) feature that can be used as a new message indicator. with valert, the device flashes an external led to indicate that a new message is present. besides, four special sound effects are rese rved for audio confirmation of operations, such as ?start record?, ?stop record?, ?erase ?, ?forward?, ?global erase?, and etc. recordings are stored into on-chip flash memory , providing zero-power message storage. this unique single-chip solution is made possible thr ough winbond?s patented multi- level storage (mls) technology. audio data are stored directly in solid-sta te memory without digital compression, providing superior quality voice and music reproduction. voice signals can be fed into the chip through two independent paths: a differential microphone input and a single-ended analog input. for outputs, the isd 1700 provides a pulse width modulation (pwm) class d speaker driver and a separate analog output simultaneously. the pwm can directly drive a standard 8 ? speaker or typical buzzer, while the separate analog output can be configured as a single-ended current or voltage output to drive an external amplifier. while in standalone mode, the isd1700 devices automat ically enter into power down mode for power conservation after an operation is completed. in the spi mode, the user has full control via the se rial interface in operating the device. this includes random access to any location inside the memory array by specifying the start address and end address of operations. spi mode also allows access to the analog path configuration (apc) register. this register allows flexible configuration of audio paths, inputs, outputs and mixing. the apc default configuration for standalone mode can also be modifi ed by storing the apc data into a non-volatile register (nvcfg) that is loaded at initialization. utilizing the capabilities of isd1700 series, designers have the control and flexibility to implement vo ice functionality into the high-end products. notice: the specifications are subject to change wi thout notice. please cont act winbond sales offices or representatives to verify current or fu ture specifications. also refer to the website for any related application notes.
isd1700 series - 4 - 2 features y integrated message management systems for single-chip, push-button applications o rec : level-trigger for recording o pla y : edge-trigger for individual message or leve l-trigger for looping playback sequentially o erase : edge-triggered erase for first or last mess age or level-triggered erase for all messages o fwd : edge-trigger to advance to the next message or fast message scan during the playback o vol : 8 levels output volume control o int rdy : ready or busy status indication o reset : return to the default state o automatic power-down after each operation cycle y selectable sampling frequency controlled by an external oscillator resistor sampling frequency 12 khz 8 khz 6.4 khz 5.3 khz 4 khz rosc 60 k ? 80 k ? 100 k ? 120 k ? 160 k ? y selectable message duration o a wide range selection from 30 secs to 240 secs at 8 khz sampling frequency sample freq. ISD1730 isd1740 isd1750 isd1760 isd1790 isd17120 isd17150 isd17180 isd17210 isd17240 12 khz 20 secs 26 secs 33 secs 40 secs 60 secs 80 secs 100 secs 120 secs 140 secs 160 secs 8 khz 30 secs 40 secs 50 secs 60 secs 90 secs 120 secs 150 secs 180 secs 210 secs 240 secs 6.4 khz 37 secs 50 secs 62 secs 75 secs 112 secs 150 secs 187 secs 225 secs 262 secs 300 secs 5.3 khz 45 secs 60 secs 75 secs 90 secs 135 secs 181 secs 226 secs 271 secs 317 secs 362 secs 4 khz 60 secs 80 secs 100 secs 120 secs 180 secs 240 secs 300 secs 360 secs 420 secs 480 secs y message and operation indicators o four customizable sound effects (ses) for audible indication o optional valert (voicealert) to i ndicate the presence of new messages o led: stay on during recording, blink dur ing playback, forward and erase operations y dual operating modes o standalone mode: ? integrated message management techniques ? automatic power-down after each operation cycle o spi mode: ? fully user selectable and controllable options via apc register and various spi commands y two individual input channels o mic+/mic-: differential microphone inputs wi th agc (automatic gain control) o anain: single-ended auxiliary analog i nput for recording or feed-through y dual output channels o differential pwm class d speaker outputs directly drives an 8 ? speaker or a typical buzzer o configurable aud (current) or aux (voltage) single-ended output drives external aduio amplifier y chipcorder standard features o high-quality, natural voice and audio reproduction o 2.4v to 5.5v operating voltage o 100-year message retention (typical) o 100,000 record cycles (typical)
isd1700 series publication release date: september 27, 2006 - 5 - revision 1.3-s y temperature options: o commercial: 0 c to +50 c (die); 0 c to +70 c (packaged units) o industrial: -40 c to +85 c (packaged units) y packaging types: available in die, pdip, soic and tsop y package option: lead-free packaged units 3 block diagram internal clock timing nonvolatile multi-level storage array power conditioning automatic gain control anti- aliasing filter smoothing filter sampling clock sp+ sp- v cca agc mic- mic+ r osc aud / aux amp v ccd v ssd device control v ssa v ssp1 v ccp spi interface miso mosi sclk ss rec play erase ft volume control anain amp mux agc amp anain amp v ssp2 fwd vol led int/rdy reset
isd1700 series - 6 - 4 pinout configuration soic / pdip isd1700 v ccd play reset int / rdy fwd v ssa ft led 28 27 26 25 24 23 22 mic- mic+ v cca 21 sp- erase 1 2 3 4 5 6 7 8 9 10 11 12 13 14 20 19 18 17 16 15 rec mosi ss sclk miso anain v ssp2 v ccp v ssp1 sp+ aud / aux agc vol r osc v ssd tsop isd1700 v ssa mic- mic+ sp- 1 2 3 4 5 6 7 8 9 10 11 12 13 14 anain v ssp2 v ccp v cca v ssp1 sp+ aud/aux agc r osc vol v ccd mosi sclk miso int / rdy 28 27 26 25 24 23 22 21 20 19 18 17 16 15 rec v ssd led reset ss ft play erase fwd
isd1700 series publication release date: september 27, 2006 - 7 - revision 1.3-s 5 pin description pin name pdip / soic tsop functions v ccd 1 22 digital power supply : power supply for digital circuitry. led 2 23 led : an led output. reset 3 24 reset : when active, the device enters into a known state. miso 4 25 master in slave out: data is shifted out on the falling edge of sclk. when the spi is inactive ( ss = high) , it?s tri-state. mosi 5 26 master out slave in: data input of the spi interface when isd1700 is a slave. data is latched into the device on the rising edge of sclk. sclk 6 27 serial clock: clock of the spi interface. ss 7 28 slave select: selects as a slave device and enables the spi interface. v ssa 8 1 analog ground : ground path for analog circuitry. anain 9 2 anain: auxiliary analog input to the devic e for recording or feed-through. mic+ 10 3 mic+: non-inverting input of the differential microphone signal. mic- 11 4 mic-: inverting input of the differential microphone signal. v ssp2 12 5 ground : ground path for negative pwm speaker drive. sp- 13 6 sp- : the negative class d pwm speaker output. v ccp 14 7 power supply for pwm speaker driver : power for pwm speaker drive. sp+ 15 8 sp+: the positive class d pwm speaker output. v ssp1 16 9 ground : ground path for positive pwm speaker drive. aud/aux 17 10 auxiliary output : either an aud (current) or aux (voltage) output. agc 18 11 automatic gain control (agc) : the agc adjusts the gain of the mircophone preamplifier circuitry. vol 19 12 volume: this control has 8 levels of volume adjustment. r osc 20 13 oscillator resistor : a resistor determines the sample frequency of the device, which sets the duration. v cca 21 14 analog power supply . power supply for analog circuitry. ft 22 15 feed-through: enable the feed-through path for anain signal to the outputs. pla y 23 16 playback: plays the recorded message individually, or plays messages sequential in a looping mode. rec 24 17 record: when active, starts recording message. erase 25 18 erase: when active, can erase indivi dual message or do global erase. fwd 26 19 forward: advances to the next message from the current location. int rdy 27 20 an open drain output. can review ready or interrupt status. v ssd 28 21 digital ground : ground path for digital circuitry
isd1700 series - 8 - 6 modes of operations the isd1700 series can operate in either standalone (push-button) or microcontroller (spi) mode. 6.1 s tandalone (p ush -b utton ) m ode one can utilize the rec , pla y , ft , fwd , erase , vol or reset control to initiate a desired operation. as completed, the device autom atically enters into the power-down state. 6.2 spi m ode in spi mode, control of the device is achiev ed through the 4-wire serial interface via spi commands. for technical details, please refer to the design guide. 7 timing diagrams the following estimated timing diagrams are not in proper scale. 7.1 b asic o peration t r t f rdy t deb rec t er t sc1 t ru t rd t set1 mic+/-, anain led figure 12.1: record operation with no sound effect
isd1700 series publication release date: september 27, 2006 - 9 - revision 1.3-s rdy sp+, sp- play t deb t sc1 t set1 t r t sc2 t ru t lh t f led t cyc t deb t rd > t deb figure 12.2: start and stop playback operation erase rdy t deb t sc1 t rd t r t f led t sc2 t ls2 t sc2 t e > t deb figure 12.3: single erase operation with no sound effect
isd1700 series - 10 - fwd rdy t deb t sc1 t rd t r t f led t sc2 t ls1 or t ls2 > t deb figure 12.4: forward operation with no sound effect sp+, sp- note: if ses are recorded, then sp+/- will have output. erase rdy t deb t sc1 t rd t r t f led t ge1 or (t e + t ls2 or t se2 ) t sc2 t ge2 3x(t ls1 or t se1 ) t ls4 or t se4 figure 12.5: global erase operati on with or without sound effects
isd1700 series publication release date: september 27, 2006 - 11 - revision 1.3-s reset rdy t reset t r t f led device returns to power down state t set2 figure 12.6: reset operation rdy aud play t deb t sc1 t rd t r t sc2 t ru t lh t f led t cyc > t deb t ru t rd figure 12.7: playback operation with ramp up and ramp down effect at aud output
isd1700 series - 12 - 7.2 spi o peration t ssh t ssmin t sckhi t sss t dis t dih t scklow t df (tristate) ss sclk mosi miso lsb t pd msb lsb msb figure 12.8: spi operation parameter symbol min typ max units ss setup time t sss 500 nsec ss hold time t ssh 500 nsec data in setup time t dis 200 nsec data in hold time t dih 200 nsec output delay t pd 500 nsec output delay to highz t df 500 nsec ss high t ssmin 1 sec sclk high time t sckhi 400 nsec sclk low time t scklow 400 nsec clk frequency f 0 1,000 khz power-up delay [1] t pud 50 msec notes: [1] the value shown is based upon 8 khz sampling frequency. delay increases proportionally for slower sampling frequency.
isd1700 series publication release date: september 27, 2006 - 13 - revision 1.3-s 8 absolute maximum ratings absolute maximum ratings (die) [1] conditions values junction temperature 150 0 c storage temperature range -65 0 c to +150 0 c voltage applied to any pads (v ss - 0.3v) to (v cc + 0.3v) power supply voltage to ground potential -0.3v to +7.0v absolute maximum ratings (packaged parts) [1] conditions values junction temperature 150 0 c storage temperature range -65 0 c to +150 0 c voltage applied to any pins (v ss - 0.3v) to (v cc + 0.3v) voltage applied to any pin (input current limited to +/-20 ma) (v ss ? 1.0v) to (v cc + 1.0v) power supply voltage to ground potential -0.3v to +7.0v [1] stresses above those listed may cause permanent damage to the devic e. exposure to the absolute maximum ratings may affect device reliability. func tional operation is not imp lied at these conditions. 8.1 o perating c onditions operating conditions (die) conditions values operating temperature range 0c to +50c supply voltage (v cc ) [1] +2.4 v to +5.5 v ground voltage (v ss ) [2] 0 v input voltage (v cc ) [1] 0 v to 5.5 v voltage applied to any pins (v ss ?0.3 v) to (v cc +0.3 v) operating conditions (packaged parts) conditions values operating temperature range (case temperature) -40c to +85c supply voltage (v dd ) [1] +2.4v to +5.5v ground voltage (v ss ) [2] 0v input voltage (v dd ) [1] 0v to 5.5v voltage applied to any pins (v ss ?0.3v) to (v dd +0.3v) [1] v cc = v cca = v ccd = v ccp [2] v ss = v ssa = v ssd = v ssp1 v ssp2
isd1700 series - 14 - 9 electrical characteristics 9.1 dc p arameters parameter symbol min typ [1] max units conditions supply voltage v dd 2.4 5.5 v input low voltage v il v ss -0.3 0.3xv dd v input high voltage v ih 0.7xv dd v dd v output low voltage v ol v ss -0.3 0.3xv dd v i ol = 4.0 ma [2] output high voltage v oh 0.7xv dd v dd v i oh = -1.6 ma [2] record current i dd_record 20 ma playback current i dd_playback 20 ma erase current i dd_erase 20 ma v dd = 5.5 v, no load, sampling freq = 12 khz standby current i sb 0.5 1 a v dd = 5.5 v, t=25 c [3] [4] input leakage current i ilpd1 1 a force v dd input current low i ilpd2 -3 -10 a force v ss , others at vcc preamp input impedance r mic+, r mic- 7 k ? power-up agc anain input impedance r anain 42 k ? when active mic differential input v in1 15 300 mv peak-to-peak [5] anain input voltage v in2 1 v peak-to-peak gain from mic to sp+/- a msp 6 40 db v in = 15~300 mv, agc = 4.7 f, v cc = 2.4v~5.5v speaker output load r spk 8 ? across both speaker pins aux output load r aux 5 k ? when active 670 mw v dd = 5.5 v 313 mw v dd = 4.4 v 117 mw v dd = 3 v speaker output power pout 49 mw v dd = 2.4 v 1vp-p, 1 khz sine wave at anain. r spk = 8 ? . speaker output voltage v out1 v dd v r spk = 8 ? (speaker), typical buzzer aux output swing v out2 1 v peak-to-peak aux output dc level v out3 1.2 v when active aud i aud -3.0 ma v dd =4.5 v, r ext = 390 ? volume output a vol 0 to -28 db 8 steps of 4db each reference to output total harmonic distortion thd 1 % 15 mv p-p 1 khz sine wave, cmessage weighted notes: [1] conditions: v cc = 4.5v, 8 khz sampling frequency and t a = 25c, unless otherwise stated. [2] led output during record operation. [3] v cca , v ccd and v ccp are connected together. v ssa , v ssp1, v ssp2 and v ssd are connected together. [4] rec , pla y , ft , fwd , erase , vol and reset must be at v ccd . [5] balanced input signal applied between mic+ and mic- as s hown in the applications example. single-ended mic+ or mic- input is recommended no more than 150 mv p-p.
isd1700 series publication release date: september 27, 2006 - 15 - revision 1.3-s 9.2 ac p arameters characteristic symbo l min typ [1] max units conditions sampling frequency [2] f s 4 12 khz [4] duration [3] t dur sect. 6.1.2 sec rising time t r 100 nsec falling time t f 100 nsec debounce time t deb 192/f s msec [4] ramp up time t ru 128/f s msec ramp down time t rd 128/f s msec initial scan time after power is applied t sc1 drn/8/f s msec drn= device row# [4] initial scan time from pd state t sc2 drn/16/f s msec after a pb operation is run [4] end recording time t er 32/f s msec [4] led high time t lh 0.5k/f s msec [4] led flash time for se1 t ls1 3.5k/f s sec se1 not recorded [5] led flash time for se2 t ls2 7.5k/f s sec se2 not recorded [5] led flash time for se3 t ls3 11.5k/f s sec se3 not recorded [5] led flash time for se4 t ls4 15.5k/f s sec se4 not recorded [5] se1 recorded duration t se1 4k/f s sec [4] [5] se2 recorded duration t se2 4k/f s sec [4] [5] se3 recorded duration t se3 4k/f s sec [4] [5] se4 recorded duration t se4 4k/f s sec [4] [5] erase time t e 10mrn/f s sec mrn=message row # [4] global erase wait time t ge1 20k/f s sec [4] [5] global erase time t ge2 34/f s sec reset pulse t reset 1 sec all fs [4] settle time t set1 128/f s msec [4] settle time after reset t set2 64/f s msec [4] led error time t lerr 27.5k/f s msec [4] [5] led cycle frequency t cyc 1 4 hz pending upon f s notes: [1] typical values: v cc = 4.5 v, f s = 8 khz and @ t a = 25c, unless otherwise stated. [2] characterization data shows that sampling frequency resolution is 5 percent across temperature and voltage ranges. [3] characterization data shows that duration resolution is 5 percent across temperature and voltage ranges. [4] vcc=2.4 v~5.5v [5] k = 1024
isd1700 series - 16 - 10 typical application circuits the following typical applications examples on isd1700 series are for references only. they make no representation or warranty that such applications s hall be suitable for the use specified. each design has to be optimized in its own system for the best performance on voice quality, current consumption, functionalities and etc. the below notes apply to the following applications examples: * these capacitors may be needed in order to optimize for the best vo ice quality, which is also dependent upon the layout of the pc b. depending on system requi rements, they can be 10 f, 4.7 f or other values. please refer to the applications notes or consult winbond for layout advice. ** it is important to have a separate path for each ground and power back to the related terminals to minimize the noise. also, the power supplies should be decoupled as close to the device as possible . example #1: recording using micr ophone input via push-button controls vcc isd1700 r osc v cca sp+ aud/aux erase play rec agc v ssd v ccd anain mic - mic+ miso mosi sclk ss fwd vol v cca 0.1 f v ccd * 24 23 25 26 19 10 11 20 18 1 28 17 22 9 v cca v ccd v ccp v ssa v ccp v ssp1 sp- v ssp2 v ccp 0.1 f 0.1 f * * 21 8 14 16 12 0.1 f * int/rdy 27 7 6 5 4 v cc 4.7 f ? 4.7 k 0.1 f 4.7 k ? 0.1 f 4.7 k ? ** ** *** at 8khz sampling freq, rosc = 80 k rosc *** 4.7 f ft 15 13 speaker or buzzer v ccd optional ? 100 k optional: based upon the applications 390 ? 0.1 f v cc 8050c speaker aux aud gnd led 1 k ? d1 2 valert 3 reset 0.1 f reset : digital ground; : analog ground; : ground for sp+; : ground for sp-
isd1700 series publication release date: september 27, 2006 - 17 - revision 1.3-s example #2: recording using anai n input via push-button controls isd1700 r osc erase play rec agc anain mic - mic+ miso mosi sclk ss fwd vol 24 23 25 26 19 10 11 20 18 22 9 7 6 5 4 *** at 8khz sampling freq, rosc = 80 k rosc *** 4.7 f ft 0.1 f : digital ground; : analog ground; : ground for sp+; : ground for sp- 3 reset 0.1 f reset vcc gnd v cca sp+ aud/aux v ssd v ccd v cca 0.1 f led 1 k ? v ccd * d1 2 1 28 17 v cca v ccd v ccp v ssa v ccp v ssp1 sp- v ssp2 v ccp 0.1 f 0.1 f * * 21 8 14 16 12 0.1 f * int/rdy 27 ** ** 15 13 speaker or buzzer v ccd optional ? 100 k valert optional: based upon the applications 390 ? 0.1 f v cc 8050c speaker aux aud
isd1700 series - 18 - example #3: connecting the spi interface to a microcontroller isd1700 r osc erase play rec agc anain mic - mic+ miso mosi sclk ss fwd vol 24 23 25 26 19 10 11 20 18 22 9 7 6 5 4 *** at 8khz sampling freq, rosc = 80 k rosc *** 4.7 f ft 0.1 f to uc spi : digital ground; : analog ground; : ground for sp+; : ground for sp- vcc gnd v cca sp+ aud/aux v ssd v ccd v cca 0.1 f led 1 k ? v ccd * d1 2 1 28 17 v cca v ccd v ccp v ssa v ccp v ssp1 sp- v ssp2 v ccp 0.1 f 0.1 f * * 21 8 14 16 12 0.1 f * int/rdy 27 ** ** 15 13 speaker or buzzer v ccd optional ? 100 k valert optional: based upon the applications 390 ? 0.1 f v cc 8050c speaker aux aud 3 reset 0.1 f reset 10.1 g ood a udio d esign p ractices to ensure the highest quality of voice reproducti on, it is important to follow good audio design practices in layout and power supply decoupling. see recommendations from below links or other application notes in our websites. design considerations for isd1700 family an-cc1002 design considerations for isd1700 family.pdf good audio design practices http://www.winbond-usa.com/products/isd_produc ts/chipcorder/applicationinfo/apin11.pdf single-chip board layout diagrams http://www.winbond-usa.com/products/isd_produc ts/chipcorder/applicationinfo/apin12.pdf
isd1700 series publication release date: september 27, 2006 - 19 - revision 1.3-s 11 packaging 11.1 28-l ead 8 x 13.4 mm p lastic t hin s mall o utline p ackage (tsop) t ype 1 - iqc a a a 2 1 l l 1 y e h d d b e c min. dimension in inches nom. max. min. nom. max. symbol 1.20 0.05 0.15 1.05 1.00 0.95 0.17 0.10 11.70 7.90 13.20 0.50 0.00 0 0.20 0.27 0.15 0.21 11.80 11.90 8.00 8.10 13.40 13.60 0.55 0.60 0.70 0.80 0.10 35 0.047 0.006 0.041 0.040 0.035 0.007 0.008 0.011 0.004 0.006 0.008 0.461 0.465 0.469 0.311 0.315 0.319 0.520 0.528 0.536 0.022 0.020 0.024 0.028 0.031 0.000 0.004 035 0.002 a a b c d e e l l y 1 1 2 a h d dimension in mm
isd1700 series - 20 - 11.2 28-l ead 300-m il p lastic s mall o utline i ntegrated c ircuit (soic) 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 45 67 8 910 11 12 13 14 a d e f b g c h min nom max min nom max a 0.701 0.706 0.711 17.81 17.93 18.06 b 0.097 0.101 0.104 2.46 2.56 2.64 c 0.292 0.296 0.299 7.42 7.52 7.59 d 0.005 0.009 0.0115 0.127 0.22 0.29 e 0.014 0.016 0.019 0.35 0.41 0.48 f 0.050 1.27 g 0.400 0.406 0.410 10.16 10.31 10.41 h 0.024 0.032 0.040 0.61 0.81 1.02 note: lead coplanarity to be within 0.004 inches. plastic small outline integrated circuit (soic) dimensions inches millimeters
isd1700 series publication release date: september 27, 2006 - 21 - revision 1.3-s 11.3 28-l ead 600-m il p lastic d ual i nline p ackage (pdip) plastic dual inline package (pdip) (p) dimensions inches millimeters min nom max min nom max a 1.445 1.450 1.455 36.70 36.83 36.96 b1 0.150 3.81 b2 0.065 0.070 0.075 1.65 1.78 1.91 c1 0.600 0.625 15.24 15.88 c2 0.530 0.540 0.550 13.46 13.72 13.97 d 0.19 4.83 d1 0.015 0.38 e 0.125 0.135 3.18 3.43 f 0.015 0.018 0.022 0.38 0.46 0.56 g 0.055 0.060 0.065 1.40 1.52 1.65 h 0.100 2.54 j 0.008 0.010 0.012 0.20 0.25 0.30 s 0.070 0.075 0.080 1.78 1.91 2.03 0 0 15 0 15 11.4 d ie i nformation for die info, please conatct the local winbond sales representatives.
isd1700 series - 22 - 12 ordering information product number descriptor key when ordering isd1700 devices, please refer to t he above ordering scheme. conatct the local winbond sales representatives for any questions and the availability. for the latest product information, please contact the winbond sales/rep or access winbond?s worldwide web site at http://www.wi nbond-usa.com i17xxx x x x x xx product series: 17 = 1700 duration: 30 : 20 ? 60 secs 40 : 26 ? 80 secs 50 : 33 ? 100 secs 60 : 40 ? 120 secs 90 : 60 ? 180 secs 120 : 80 ? 240 secs 150 : 100 ? 300 secs 180 : 120 ? 360 secs 210 : 140 ? 420 secs 240 : 160 ? 480 secs package type : x = die e = thin small outline package (tsop) s = small outline integrated circuit (soic) package p = plastic dual inline package (pdip) temperature : i = industrial (-40 c to +85 c) blank = commercial ? die (0 c to +50 c) ? package (0 c to +70 c) special features field : blank = none 01 = valert tape & reel: blank = none r = tape & reel lead-free : y = lead-free product name: i = isd
isd1700 series publication release date: september 27, 2006 - 23 - revision 1.3-s 13 version history version date description 1.3-s sep 2006 initial version
isd1700 series - 24 - headquarters winbond electronics corporation america winbond electronics (shanghai) ltd. no. 4, creation rd. iii 2727 north first street, san jose, 27f, 299 yan an w. rd. shanghai, science-based industrial park, ca 95134, u.s.a. 200336 china hsinchu, taiwan tel: 1-408-9436666 tel: 86-21-62365999 tel: 886-3-5770066 fax: 1-408-5441797 fax: 86-21-62356998 fax: 886-3-5665577 http://www.winbond-usa.com/ http://www. winbond.com.tw/ taipei office winbond electronics corporati on japan winbond electronics (h.k.) ltd. 9f, no. 480, pueiguang rd. 7f daini-ueno bldg. 3-7-18 unit 9-15, 22f, millennium city, neihu district shinyokohama kohokuku, no. 378 kwun tong rd., taipei, 114 taiwan yokohama, 222-0033 kowloon, hong kong tel: 886-2-81777168 tel: 81-45-4781881 tel: 852-27513100 fax: 886-2-87153579 fax: 81-45-4781800 fax: 852-27552064 please note that all data and specifications are subject to change without notice. all the trademarks of products and companies mentioned in this datasheet belong to their respective owners. winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or fo r other applications intended to support or sustain life. furthermore, winbond products are not intended fo r applications wherein failure of winbond products could result or lead to a situation wherein personal injury, deat h or severe property or environmental damage could occur. winbond customers using or selling these products for use in su ch applications do so at their own risk and agree to fully indemnify winbond for any damages resulting from such improper use or sales. the contents of this document are provided only as a guide for the applications of winbond products. winbond makes no representation or warranties with respect to the accuracy or completeness of the c ontents of this publication and reserves the right to discontinue or make changes to specif ications and product descriptions at any time without notice. no license, whether express or implied, to any intellectual property or other right of winbond or others is granted by this publication. except as set forth in winbond's standard terms and conditions of sale, winbond assumes no liability whatsoever and disclaims any express or implied warrant y of merchantability, fitness for a particular purpose or infringement of any intellectual property. the contents of this document are pr ovided ?as is?, and winbond assumes no liability whatsoever and disclaims any express or implied warranty of merchant ability, fitness for a particular purpose or infringement of any intellectual property. in no event, shall winbond be liable for any damages w hatsoever (including, wit hout limitation, damages for loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this documents, even if winbond has been advised of the possibility of such damages. application examples and alternative uses of any integrated circuit contained in this publication are for illustration only and winbond makes no representation or warranty that such applications shall be suitable for the use specified. the 100-year retention and 100k record cycle projections are based upon accelerated reliability tests, as published in the winbond reliability report, and are nei ther warranted nor guaranteed by wi nbond. this product incorporates superflash ? . this datasheet and any future addendum to this datasheet is(are) the complete and controlling isd ? chipcorder ? product specifications. in the event any inconsistenc ies exist between the information in this and other product documentation, or in the event that other product documentat ion contains information in addition to the information in this, the information contained herein supersedes and governs su ch other information in its entirety. this datasheet is subject to change without notice. copyright ? 2005, winbond electronics corporation. all rights reserved. chipcorder ? and isd ? are trademarks of winbond electronics corporation. superflash ? is the trademark of silicon storage technology, inc. all other trademarks are properties of their respective owners.

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